一般(ban)說來，是(shi)(shi)根據設(she)計(ji)要(yao)求(qiu)進行(xing)測試(shi)，不(bu)(bu)(bu)符合(he)設(she)計(ji)要(yao)求(qiu)的(de)(de)(de)就是(shi)(shi)不(bu)(bu)(bu)合(he)格。而設(she)計(ji)要(yao)求(qiu)，因產品(pin)(pin)不(bu)(bu)(bu)同而各不(bu)(bu)(bu)相同，有的(de)(de)(de)IC需要(yao)測試(shi)大(da)量(liang)的(de)(de)(de)參數，有的(de)(de)(de)則只需要(yao)測試(shi)很(hen)少的(de)(de)(de)參數。事實上，一個具體的(de)(de)(de)IC，并(bing)不(bu)(bu)(bu)一定要(yao)經(jing)歷(li)上面(mian)提(ti)到的(de)(de)(de)全部測試(shi)，而經(jing)歷(li)多道(dao)測試(shi)工序的(de)(de)(de)IC，具體在哪個工序測試(shi)哪些(xie)參數，也是(shi)(shi)有很(hen)多種變化(hua)的(de)(de)(de)，這是(shi)(shi)一個復雜(za)的(de)(de)(de)系統工程。例(li)如對于芯(xin)(xin)片(pian)(pian)面(mian)積大(da)、良(liang)率高(gao)、封裝成本(ben)(ben)低的(de)(de)(de)芯(xin)(xin)片(pian)(pian)，通常可以不(bu)(bu)(bu)進行(xing)wafertest，而芯(xin)(xin)片(pian)(pian)面(mian)積小(xiao)、良(liang)率低、封裝成本(ben)(ben)高(gao)的(de)(de)(de)芯(xin)(xin)片(pian)(pian)，Z好將很(hen)多測試(shi)放(fang)在wafertest環節(jie)，及早發(fa)現不(bu)(bu)(bu)良(liang)品(pin)(pin)，避(bi)免不(bu)(bu)(bu)良(liang)品(pin)(pin)混入(ru)封裝環節(jie)，無謂地增加封裝成本(ben)(ben)。芯(xin)(xin)片(pian)(pian)測試(shi)機是(shi)(shi)電(dian)路設(she)計(ji)和制造(zao)的(de)(de)(de)重要(yao)工具。廣東芯(xin)(xin)片(pian)(pian)測試(shi)機

當自(zi)(zi)動(dong)(dong)(dong)上料裝(zhuang)置(zhi)(zhi)(zhi)40的(de)位于較上方的(de)tray盤(pan)(pan)中的(de)50個(ge)芯(xin)(xin)(xin)片(pian)(pian)全(quan)部完成(cheng)測(ce)(ce)試(shi)后(hou)(hou)，50個(ge)芯(xin)(xin)(xin)片(pian)(pian)中出現1個(ge)或2個(ge)不(bu)合格(ge)品時，此時自(zi)(zi)動(dong)(dong)(dong)下(xia)(xia)料裝(zhuang)置(zhi)(zhi)(zhi)50的(de)tray盤(pan)(pan)沒(mei)有放(fang)滿(man)50個(ge)芯(xin)(xin)(xin)片(pian)(pian)。則此時該(gai)測(ce)(ce)試(shi)方法還包(bao)括以(yi)下(xia)(xia)步驟：將(jiang)自(zi)(zi)動(dong)(dong)(dong)上料裝(zhuang)置(zhi)(zhi)(zhi)40的(de)空的(de)tray盤(pan)(pan)移載至(zhi)中轉裝(zhuang)置(zhi)(zhi)(zhi)60，然(ran)后(hou)(hou)從自(zi)(zi)動(dong)(dong)(dong)上料裝(zhuang)置(zhi)(zhi)(zhi)40的(de)下(xia)(xia)一個(ge)tray盤(pan)(pan)中吸取芯(xin)(xin)(xin)片(pian)(pian)進行測(ce)(ce)試(shi)，并將(jiang)測(ce)(ce)試(shi)合格(ge)的(de)芯(xin)(xin)(xin)片(pian)(pian)放(fang)置(zhi)(zhi)(zhi)到自(zi)(zi)動(dong)(dong)(dong)下(xia)(xia)料裝(zhuang)置(zhi)(zhi)(zhi)50，直至(zhi)自(zi)(zi)動(dong)(dong)(dong)下(xia)(xia)料裝(zhuang)置(zhi)(zhi)(zhi)50的(de)tray盤(pan)(pan)中放(fang)滿(man)測(ce)(ce)試(shi)合格(ge)的(de)芯(xin)(xin)(xin)片(pian)(pian)，然(ran)后(hou)(hou)將(jiang)中轉裝(zhuang)置(zhi)(zhi)(zhi)60的(de)空的(de)tray盤(pan)(pan)移載至(zhi)自(zi)(zi)動(dong)(dong)(dong)下(xia)(xia)料裝(zhuang)置(zhi)(zhi)(zhi)50。廣東芯(xin)(xin)(xin)片(pian)(pian)測(ce)(ce)試(shi)機芯(xin)(xin)(xin)片(pian)(pian)測(ce)(ce)試(shi)機可以(yi)檢測(ce)(ce)芯(xin)(xin)(xin)片(pian)(pian)的(de)電學參數，包(bao)括電流和電壓等。

芯(xin)(xin)片(pian)測(ce)試(shi)(shi)機是一種專門用來檢測(ce)芯(xin)(xin)片(pian)的工具。它可以在(zai)生產(chan)中測(ce)試(shi)(shi)集成(cheng)電路芯(xin)(xin)片(pian)的功能和(he)性能，來確保芯(xin)(xin)片(pian)質量符合(he)設(she)(she)計(ji)要求。芯(xin)(xin)片(pian)測(ce)試(shi)(shi)機的主要作(zuo)用是對芯(xin)(xin)片(pian)的電學(xue)參數和(he)邏(luo)輯(ji)特(te)性進(jin)行(xing)測(ce)量，然(ran)后按照預定規則進(jin)行(xing)對比，從而對測(ce)試(shi)(shi)結果進(jin)行(xing)評估。芯(xin)(xin)片(pian)測(ce)試(shi)(shi)機常見的用途是測(ce)試(shi)(shi)運行(xing)紋理陣列器（FPGA）和(he)應用特(te)定集成(cheng)電路（ASIC）。FPGA作(zuo)為(wei)可編程芯(xin)(xin)片(pian)，通常是初步設(she)(she)計(ji)，測(ce)試(shi)(shi)和(he)驗(yan)證過程中關鍵的部(bu)分(fen)。ASIC則是根據(ju)設(she)(she)定的電路、電子設(she)(she)備和(he)/或(huo)存儲器進(jin)行(xing)硬件(jian)配置的特(te)定集成(cheng)電路。

下(xia)(xia)面(mian)對本發明(ming)(ming)(ming)的(de)(de)(de)(de)(de)優點或(huo)原理進(jin)行(xing)說明(ming)(ming)(ming)：使用本發明(ming)(ming)(ming)的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)機(ji)進(jin)行(xing)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)時，首先(xian)在自(zi)(zi)動上(shang)(shang)(shang)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)上(shang)(shang)(shang)放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)多個(ge)(ge)tray盤(pan)，每一個(ge)(ge)tray盤(pan)上(shang)(shang)(shang)均放(fang)滿(man)或(huo)放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)多個(ge)(ge)待(dai)測(ce)(ce)(ce)試(shi)(shi)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)，同(tong)時在自(zi)(zi)動下(xia)(xia)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)和(he)不良品放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)臺(tai)(tai)上(shang)(shang)(shang)分別放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)空(kong)的(de)(de)(de)(de)(de)tray盤(pan)。測(ce)(ce)(ce)試(shi)(shi)機(ji)啟動后(hou)，由移(yi)(yi)(yi)載裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)從自(zi)(zi)動上(shang)(shang)(shang)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)(de)(de)tray盤(pan)中吸取待(dai)測(ce)(ce)(ce)試(shi)(shi)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)移(yi)(yi)(yi)載至(zhi)測(ce)(ce)(ce)試(shi)(shi)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)進(jin)行(xing)測(ce)(ce)(ce)試(shi)(shi)，芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)完成后(hou)，移(yi)(yi)(yi)載裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)將(jiang)測(ce)(ce)(ce)試(shi)(shi)合(he)格(ge)的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)移(yi)(yi)(yi)載至(zhi)自(zi)(zi)動下(xia)(xia)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)(de)(de)空(kong)tray盤(pan)中，將(jiang)不良品移(yi)(yi)(yi)載至(zhi)不良品放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)臺(tai)(tai)的(de)(de)(de)(de)(de)空(kong)tray盤(pan)中放(fang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)。當自(zi)(zi)動上(shang)(shang)(shang)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)(de)(de)一個(ge)(ge)tray盤(pan)中的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)全部完成測(ce)(ce)(ce)試(shi)(shi)，且(qie)自(zi)(zi)動下(xia)(xia)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)(de)(de)空(kong)tray盤(pan)中全部裝(zhuang)(zhuang)(zhuang)(zhuang)滿(man)測(ce)(ce)(ce)試(shi)(shi)后(hou)的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)后(hou)，移(yi)(yi)(yi)載裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)將(jiang)自(zi)(zi)動上(shang)(shang)(shang)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)的(de)(de)(de)(de)(de)空(kong)tray盤(pan)移(yi)(yi)(yi)載至(zhi)自(zi)(zi)動下(xia)(xia)料(liao)(liao)裝(zhuang)(zhuang)(zhuang)(zhuang)置(zhi)(zhi)(zhi)(zhi)(zhi)(zhi)。本發明(ming)(ming)(ming)的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)機(ji)的(de)(de)(de)(de)(de)結構緊湊，體積較小，占地面(mian)積只為(wei)一平米左右，可(ke)滿(man)足小批量的(de)(de)(de)(de)(de)芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)需求。芯(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)測(ce)(ce)(ce)試(shi)(shi)機(ji)還可(ke)以(yi)進(jin)行(xing)閂鎖掃(sao)描測(ce)(ce)(ce)試(shi)(shi)和(he)邊緣掃(sao)描測(ce)(ce)(ce)試(shi)(shi)。

自(zi)動(dong)(dong)上(shang)(shang)料機(ji)(ji)(ji)構(gou)42上(shang)(shang)料時，將(jiang)放(fang)滿待(dai)測芯片(pian)的(de)(de)多個(ge)tray盤上(shang)(shang)下疊放(fang)在(zai)頭(tou)一(yi)(yi)料倉(cang)41的(de)(de)第(di)二(er)移(yi)(yi)動(dong)(dong)底(di)板47上(shang)(shang)，且位(wei)(wei)于(yu)較(jiao)上(shang)(shang)層的(de)(de)tray盤位(wei)(wei)于(yu)頭(tou)一(yi)(yi)料倉(cang)41的(de)(de)開口部(bu)。移(yi)(yi)載裝置20首先吸取位(wei)(wei)于(yu)較(jiao)上(shang)(shang)層的(de)(de)tray盤中(zhong)的(de)(de)芯片(pian)進(jin)行測試(shi)，當位(wei)(wei)于(yu)較(jiao)上(shang)(shang)層的(de)(de)tray盤中(zhong)的(de)(de)芯片(pian)測試(shi)完成后，將(jiang)空的(de)(de)tray盤移(yi)(yi)載至(zhi)自(zi)動(dong)(dong)下料機(ji)(ji)(ji)構(gou)52。然(ran)后伺服(fu)電機(ji)(ji)(ji)43驅動(dong)(dong)滾珠絲(si)桿45轉動(dong)(dong)，滾珠絲(si)桿45通過頭(tou)一(yi)(yi)移(yi)(yi)動(dong)(dong)底(di)板46帶動(dong)(dong)第(di)二(er)移(yi)(yi)動(dong)(dong)底(di)板47向上(shang)(shang)移(yi)(yi)動(dong)(dong)，帶動(dong)(dong)位(wei)(wei)于(yu)下方(fang)的(de)(de)tray盤向上(shang)(shang)移(yi)(yi)動(dong)(dong)，直至(zhi)所有的(de)(de)tray盤中(zhong)的(de)(de)芯片(pian)全部(bu)測試(shi)完成。芯片(pian)測試(shi)機(ji)(ji)(ji)可以進(jin)行DC和AC測試(shi)，以檢(jian)測芯片(pian)的(de)(de)電性(xing)能。江蘇IC芯片(pian)測試(shi)機(ji)(ji)(ji)哪(na)家好

芯片(pian)測試機(ji)是一種用(yong)于測試集成電路(lu)的(de)機(ji)器。廣東芯片(pian)測試機(ji)

Open/Short Test: 檢查芯片(pian)(pian)引腳中是否有開路或短路。DC TEST: 驗(yan)證器件直流(liu)(liu)電(dian)(dian)(dian)流(liu)(liu)和電(dian)(dian)(dian)壓參數(shu)。Eflash TEST: 測試(shi)(shi)內嵌flash的(de)(de)(de)功(gong)(gong)能(neng)(neng)及(ji)性(xing)能(neng)(neng)，包含讀寫擦除動作及(ji)功(gong)(gong)耗和速(su)度(du)等各種(zhong)參數(shu)。Function TEST: 測試(shi)(shi)芯片(pian)(pian)的(de)(de)(de)邏(luo)輯(ji)功(gong)(gong)能(neng)(neng)。AC Test: 驗(yan)證交流(liu)(liu)規格，包括交流(liu)(liu)輸出信號的(de)(de)(de)質量和信號時序參數(shu)。Mixed Signal Test: 驗(yan)證DUT數(shu)模(mo)混合電(dian)(dian)(dian)路的(de)(de)(de)功(gong)(gong)能(neng)(neng)及(ji)性(xing)能(neng)(neng)參數(shu)。RF Test: 測試(shi)(shi)芯片(pian)(pian)里面(mian)RF模(mo)塊(kuai)的(de)(de)(de)功(gong)(gong)能(neng)(neng)及(ji)性(xing)能(neng)(neng)參數(shu)。芯片(pian)(pian)測試(shi)(shi)設備原(yuan)理(li)說明，對于芯片(pian)(pian)行(xing)業來(lai)說，其生(sheng)產成本(ben)是很(hen)高(gao)的(de)(de)(de)，因此，其芯片(pian)(pian)測試(shi)(shi)設備在一(yi)定程(cheng)度(du)上建議采用我們的(de)(de)(de)芯片(pian)(pian)測試(shi)(shi)設備來(lai)降(jiang)低企業運行(xing)成本(ben)，所(suo)以，芯片(pian)(pian)測試(shi)(shi)設備的(de)(de)(de)運行(xing)原(yuan)理(li)我們也不(bu)得(de)不(bu)了解清楚。廣東芯片(pian)(pian)測試(shi)(shi)機

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